MediaTek has announced its latest mid-range chipset, the Dimensity 6300. It is a successor to last year’s Dimensity 6100+ with an overclocked main Cortex-A76 CPU cluster now running at 2.4GHz instead of 2.2GHz. The chip features 2x Cortex-A76 cores paired with 6x Cortex-A55 cores clocked at 2GHz.
The Dimensity 6300 is manufactured on TSMC’s 6nm process and includes a Mali-G57 MC2 GPU. MediaTek claims the new chip should deliver a 10% increase in CPU performance compared to the previous 6100+ model.
In addition, the Dimensity 6300 features MediaTek UltraSave 3.0+ technology for power saving and an integrated 5G modem that complies with the 3GPP Release 16 standard.
This chip supports the same LPDDR4x RAM and UFS 2.2 storage as its predecessor and can drive screens with resolutions of up to 1080 x 2520px. It also supports up to 108 MP main cameras, dual-band Wi-Fi 5 (a/b/g/n/ac), and Bluetooth 5.2 connectivity.
The Realme C65 5G is expected to be the first phone to launch with the Dimensity 6300 later this month.