Qualcomm has announced its latest micropower QCC730 Wi-Fi chip, which promises improved range and data transfer rates while consuming less power and offering direct cloud connectivity. This dual-band micropower Wi-Fi chip is aimed at IoT devices, and Qualcomm is focusing on efficiency with claims of 88% less power per data transfer compared to its previous generation.
The new Wi-Fi chip also brings direct cloud connectivity and Matter integration and features an open-source SDK and IDE, as well as cloud connectivity downloaded through a software stack. It is proposed as an alternative to Bluetooth for IoT applications and can operate in hosted and guest-free mode.
In addition to the QCC730, Qualcomm also announced its RB3 Gen 2 robotics platform with on-device AI for enterprise and industrial solutions. This is Qualcomm’s mid-level offering in its robotics platform with Qualcomm’s QCS6490 CPU (8 cores, up to 2.7GHz), Adreno 643 GPU, support for multiple camera sensors, and an integrated Wi-Fi 6E chip. You also get Bluetooth 5.2 and LE audio.
Qualcomm is deploying the RB3 Gen 2 platform on a wider range of products including drones, cameras, and other industrial devices. Development kits come with a power supply, speakers, USB cable, and a development board. Qualcomm also offers Vision Kits with mounting brackets and Camera Serial Interface (CSI) cameras.
Qualcomm’s RB3 Gen 2 is expected to be available from June.