The brand new Vivo X Fold3 Pro is the slimmest new foldable to launch in China, and there are rumors that it may soon be available in other markets. If you are curious about how Vivo managed to achieve its impressive thin and light appearance, then the new teardown video by WekiHome is definitely worth watching.
In the teardown process, to start with, the device is turned off, and the SIM card slot, which is impressively thin on the X Fold3 Pro, is removed. By applying heat to the sides and a bit of force with a pick from the back cover – which is also quite thin, but made of a reinforced fiber composite – the host details the process. The cover screen is then removed, revealing the other side of the back.
Underneath, there is a massive sheet of copper foil to prevent overheating of the display panel, next to a second-generation Qualcomm ultrasonic fingerprint scanner. The motherboard has a double-stacked design with a trio of camera sensors at the top, held in place by an interesting plastic cover that also houses the flash cable, microphone, ambient light sensor, and laser focus module. Close-ups of the camera sensors and some sample photos are shown.
Further into the teardown, the motherboard is revealed to house the Snapdragon 8 Gen 3 chip, Samsung LPDDR5X RAM, and UFS 4.0 storage modules, along with the Vivo V3 graphics chip. A copper vapor chamber is located under the board to regulate thermals. The video also showcases the speakers, microphones, vibration motor, and the dual-cell 5,700 mAh silicon anode battery split between two 2,850 mAh cells.
An interesting fact is that the newer X Fold3 Pro features a smaller VC vapor chamber than its predecessor. The final part of the video highlights the lightweight carbon fiber hinge that weighs just under 15 grams.