The Redmi K70 Pro was recently revealed for the Chinese market, and a local channel has already conducted a teardown of the device, showcasing its internal components.
Undoubtedly the most high-end Redmi smartphone ever produced, it is powered by the latest chipset from Qualcomm, marking a first for the brand and fitting for its ten-year anniversary. If you don’t speak Chinese, English subtitles are available by clicking the CC button in the player below.
The teardown provides detailed information about the phone’s components, including the camera sensors and manufacturers of the different chipsets onboard. It is a quick yet informative look at the device.
To recap, the Redmi K70 Pro features a 6.67-inch 1440×3200 120 Hz OLED display with 4,000-nit peak brightness, the Snapdragon 8 Gen 3 SoC, 12/16/24 GB RAM, 256 GB/512 GB/1 TB storage, a rear camera system (50 MP main with OIS, 12 MP ultra-wide, 50 MP 2x optical zoom), a 16 MP selfie camera, and a 5,000 mAh battery with 120W wired charging support.